Chemical-mechanical planarization (CMP) was originally developed to overcome processing issues in microelectronics manufacturing, such as planarization of interlayer dielectric materials. The technology was then extended to enable the manufacturing of structures that were impossible or difficult to build, for example, for multilevel constructions like micromotors, gears, or micromirrors. How have the applications of this technology evolved and what are the new developments?
Included in this Intelligence Brief:
Identification of several applications for this technique, providing for each identified application:
- Description of how CMP is utilized
- Benefits of this technique
- Differentiators for specific applications
- High level trends of CMP for this application
Identified centers of excellence globally in CMP research, providing for each identified center/research group:
- List of relevant research articles and patents pertaining to chemical-mechanical planarization
- Description of research efforts/goals
- Highlight industry partners
- Highlight roadblocks to evolution of CMP technology
